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INDUSTRIAL APPLICATION I CAN GIVE EVERYTHING YOU WANT.

THE PROTECTION OF WAFER CUTTING

UV tape is specially designed for wafer grinding, cutting, load-bearing processing of fine electronic parts, and processing and cutting of small parts of various materials; coated with special adhesive, with high adhesion, can be cut with super adhesion T

SOLVE THE PAIN POINT

High adhesion, no chip scattering, no glue residue

APPLICATION CASE